我们在SAW级钽酸锂的种植和批量生产方面有丰富的经验。我们拥有先进的晶体生长、晶圆研磨、抛光、检测设备，所有成品均通过居里温度测试和QC检验。
我们的研发团队积极致力于各种掺杂铁晶片和电子元件从新材料到成品的开发和研究。
| Material | LiTaO3 wafers（White or Black &Fe doped） | |
| Curie Temp | 603±2℃ | |
| Cutting Angle | X/Y/Z/X112Y/Y36/Y42/Y48/etc | |
| Diameter/size | 3”/4”/6" LT wafer | |
| Tol(±) | <0.20 mm | |
| Thickness | 0.18 ~ 0.5mm or more | |
| Primary Flat | 22mm /32mm /42.5mm /57.5mm | |
| LTV (5mmx5mm) | <1µm | |
| TTV | <3µm | |
| Bow | -30<bow<30 | |
| Warp | <40µm | |
| PLTV(<0.5um) | ≥95%(5mm*5mm) | |
| Orientation Flat | All available | |
| Surface Type | Single Side Polished /Double Sides Polished | |
| Polished side Ra | <0.5nm | |
| Back Side Criteria | General is 0.2-0.5µm or as customized | |
| Edge Criteria | R=0.2mm or Bullnose | |
| Fe doped | Fe doped for saw grade LN< wafers | |
| Wafer Surface Criteria | Transmissivity | general:5.9x10-11<s<2.0*10-10 at 25℃ |
| Contamination, | None | |
| Particles ￠>0.3 µ m | <= 30 | |
| Scratch , Chipping | None | |
| Defect | No edge cracks, scratches, saw marks, stains | |
| Packaging | Qty/Wafer box | 25pcs per box |
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